| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite sheet for protective film formation which can reduce the number of manufacturing steps of semiconductor device, exhibits an excellent holding force for a jig, e.g., a ring frame, and excellent peelability during pick-up.SOLUTION: A composite sheet 10 for protective film formation includes a film 4 for protective film formation provided on the first adhesive layer of an adhesive sheet 5, including a base material 1 and the first adhesive layer 2 as constituent layers, with a second adhesive layer 3 interposed therebetween. The shape of the second adhesive layer, in the plan view, is included in the shape of the adhesive sheet in the plan view, and the second adhesive layer is composed of a non-energy-ray curable adhesive composition. |
