MULTILAYER CHEMICAL MECHANICAL POLISHING PAD WITH BROAD-SPECTRUM ENDPOINT DETECTION WINDOW

摘要

PROBLEM TO BE SOLVED: To solve a problem that a window block used in a window part for detection of a substrate polishing endpoint deteriorates when exposed to light with wavelengths shorter than 400 nm.SOLUTION: A multilayer chemical mechanical polishing pad is provided, comprising: a polishing layer 20 having a polishing surface 14, a counterbore opening 40, a polishing layer interfacial region 24 parallel to the polishing surface; a porous subpad layer 50 having a bottom surface and a porous subpad layer interfacial region 27 parallel to the bottom surface; and a broad-spectrum endpoint detection window block 30 comprising a cyclic olefin copolymer. The window block exhibits a uniform chemical composition across its thickness. The polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region. The multilayer chemical mechanical polishing pad has a through opening 35 that extends from the polishing surface to the bottom surface of the porous subpad layer. The counterbore opening opens on the polishing surface, enlarges the through opening, and forms a ledge 45. The window block is disposed within the counterbore opening.