发明名称 |
SELECTIVE EPITAXIAL GROWTH METHOD AND DEPOSITION DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a selective epitaxial growth method capable of suppressing an increase in processing time without deteriorating crystallinity of an epitaxial layer and flatness of a surface of the epitaxial layer.SOLUTION: A selective epitaxial growth method includes the steps of: growing an epitaxial layer on an epitaxial growth region by supplying a material gas onto a growth suppression film under a first processing pressure (step 4); removing the deposit deposited due to supply of the material gas onto the growth suppression film in the step 4 (step 5); growing a new epitaxial layer on the epitaxial layer grown on the epitaxial growth region by supplying the material gas onto the growth suppression film under a second processing pressure higher than the first processing pressure (step 6); and removing the deposit deposited due to supply of the material gas onto the growth suppression film in the step 6 (step 7). This method repeats the step 6 and the step 7 until the epitaxial layer reaches a designed film thickness. |
申请公布号 |
JP2014175337(A) |
申请公布日期 |
2014.09.22 |
申请号 |
JP20130043995 |
申请日期 |
2013.03.06 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
SUZUKI DAISUKE;KAKIMOTO AKINOBU;ONODERA SATOSHI |
分类号 |
H01L21/205;H01L21/20;H01L21/28;H01L21/285;H01L21/768 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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