发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a semiconductor device to which individual identification information is assigned in a semiconductor substrate in which a thin film is formed on a surface thereof and which is capable of suppressing a decrease in productivity, and a method for manufacturing the same.SOLUTION: A semiconductor device comprises: an absorption film 6 as a first film formed on a silicon substrate 4 as a semiconductor substrate; a contour forming film 7 formed on the absorption film 6 as a second film; and a peeling part formed reaching from a surface of the contour forming film 7 to a surface of the absorption film 6. The contour forming film 7 is composed of a plurality of the same materials as the absorption film 6. The composition ratio of the contour forming film 7 differs from the composition ratio of the absorption film 6. The light absorptivity of the contour forming film 7 is lower than the light absorptivity of the absorption film 6.</p>
申请公布号 JP2014175632(A) 申请公布日期 2014.09.22
申请号 JP20130049876 申请日期 2013.03.13
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKENAKA MICHIAKI
分类号 H01L21/02 主分类号 H01L21/02
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