| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board excellent in reliability of connection with an electronic component, a mounting structure using the same, and a method of manufacturing a wiring board.SOLUTION: A wiring board 3 according to one embodiment of the present invention includes: an inorganic insulating layer 14 having a plurality of first inorganic insulating particles 21, which have an average particle diameter of 3 to 110 nm inclusive and contain sodium while containing silicon oxide as a main component and some of which are connected to each other, and having a resin part 19 disposed in gaps 18 between the plurality of first inorganic insulating particles 21; and a conductive layer 11 disposed on the inorganic insulating layer 14. As a result, the rigidity of the wiring board 3 can be enhanced. Therefore, warpage of the wiring board 3 is suppressed, and thus the wiring board 3 excellent in reliability of connection with an electronic component 2 can be obtained. |
