发明名称 CUTTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cutting device the upsizing of which can be suppressed, while dealing with the upsizing of a workpiece.SOLUTION: A cutting device 1 includes chuck tables 10a, 10b for holding a workpiece W, cutting means 20a, 20b, and cleaning means 50a, 50b. The cutting means 20a, 20b have the axial direction of a spindle in parallel with the Y axis. The cutting means 20a, 20b are moved up and down freely in the Z axis direction by Z axis moving means, machining fed in the X axis direction by X axis moving means 70a, 70b, and indexing fed in the Y axis direction by Y axis moving means 60a, 60b. The cleaning means 50a cleans the workpiece W held on the chuck table 10a. The cleaning means 50b cleans the workpiece W held on the chuck table 10b.
申请公布号 JP2014175422(A) 申请公布日期 2014.09.22
申请号 JP20130045988 申请日期 2013.03.07
申请人 DISCO ABRASIVE SYST LTD 发明人 OTANI HIDEAKI
分类号 H01L21/301;B24B27/06 主分类号 H01L21/301
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