| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for chemical-mechanical polishing.SOLUTION: In accordance with certain embodiments, a method can be utilized that includes depositing a backfill material layer 216 over a reader stack; depositing a chemical-mechanical-polishing stop layer 218 above the backfill material layer 216; and depositing a sacrificial layer 220 on top of the chemical-mechanical-polishing stop layer 218. |
