| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire bonding apparatus capable of easily and swiftly taking measures when the shape of a film substrate to be crimped to a board is changed.SOLUTION: The wire bonding apparatus includes: a crimp head 13 having a crimp tool 23 for crimping a terminal group for external connection 3a of a film substrate 3 to a board 2, and a crimp tool lifting mechanism 22 that drives the crimp tool 23 to move vertically; and a film substrate holding unit 26 that holds the film substrate 3 in a state that the terminal group for external connection 3a is positioned below the crimp tool 23. The film substrate holding unit 26 has plural suction parts 54, 65 detachably attached to the crimp head 13 at a position corresponding to the shape of the film substrate 3. |
