| 摘要 |
Presented herein are an interconnect structure and method for forming the same. The interconnect structure comprises a contact pad disposed over a substrate and a connector disposed over the substrate and spaced apart from the contact pad. A passivation layer is disposed over the contact pad and over the connector, and includes a contact pad opening, a connector opening and a mounting pad opening. A post passivation layer comprising a trace and a mounting pad is disposed over the passivation layer. The trace may be disposed in the contact pad opening and contacts the mounting pad, and further disposed in the connector opening and contacts the connector. The mounting pad may be disposed in the mounting pad opening and contacts the opening. The mounting pad is separated from the trace by a trace gap, wherein the trace gap may optionally be at least 10 μm. |
