| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling substrate, a package for housing an element including the cooling substrate, and a mounting structure.SOLUTION: A cooling substrate 8 includes a first substrate 81, a cooling frame 82 provided on the first substrate 81 along the outer edge of the first substrate 81, a bent member 83 provided in the cooling frame 82 on the first substrate 81, and formed by bending a plate to be convex upward and downward regularly, and a second substrate 85 provided on the cooling frame 82 to cover the bent member 83. The bent member 83 bonds the upper surface of the first substrate 81 and a part convex downward, and bonds the lower surface of the second substrate 85 and a part convex upward. |
