| 摘要 |
PROBLEM TO BE SOLVED: To prevent a substrate transfer fork from hitting a semiconductor substrate, when inserting the substrate transfer fork between the semiconductor substrates of a substrate holder, after the semiconductor substrate is heat treated.SOLUTION: A heat treatment apparatus performing heat treatment by housing a substrate holder, for holding a plurality of semiconductor substrates like a shelf, in a heat treatment furnace includes a housing of the heat treatment apparatus, and a base plate attached to the housing. The substrate holder includes a substrate transfer fork for mounting the semiconductor substrate, and a vertical movement mechanism attached in the base plate for driving the substrate transfer fork to move in the vertical direction. Furthermore, a member for attaching the base plate to the housing so as to allow vertical movement of the base plate with respect to the housing is provided. |
