SINGLE MASK PACKAGE APPARATUS AND METHOD

摘要

Disclosed herein is a single mask package apparatus on a device comprising: a first substrate having a land disposed on a first surface; a stud disposed on the land; and a protective layer disposed on the first surface of the first substrate and around the stud. The protective layer may optionally have a thickness of at least 3 μm. A PPI may be disposed on the protective layer and in electrical contact with the stud, with a first portion of the PPI extending laterally from the stud. An interconnect unit may be disposed on and in electrical contact with the first portion of the PPI, and a second substrate is mounted on the interconnect unit. A molding compound may be disposed on the PPI and around the interconnect unit. The stud may substantially be a solid material having a cylindrical cross section and may optionally be wire-bonded to the land.