发明名称 PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed circuit board, and more specifically a printed circuit board having insulating layer crack preventing part.SOLUTION: A printed circuit board comprises: an insulating layer part having at least one pair of insulating layers stacked therein; circuit patterns formed on the insulating layers, respectively; and crack preventing parts formed at positions at which they are not interfered by the respective circuit patterns of the insulating layer part and supporting the insulating layer part from external impact.
申请公布号 JP2014175655(A) 申请公布日期 2014.09.22
申请号 JP20140029290 申请日期 2014.02.19
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 JUNG JOONG HYUK;YU KWAN SONG;KIM JONG HYUNG;SUNG HOON BAEK;KANG HYEA HYEN
分类号 H05K1/02;H05K3/34 主分类号 H05K1/02
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