发明名称 ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT COOLING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide an electronic component which effectively radiates heat generated in the electronic component and achieves cooling effect.SOLUTION: An electronic component includes: a substrate; a cooling channel which is molded at the substrate and used for passing a cooling medium from a first direction to a second direction; and a radiator which is formed on a surface of the cooling channel using a material having heat conductivity higher than the substrate or is formed at the cooling channel so as to protrude and contacts with the cooling medium.</p>
申请公布号 JP2014175351(A) 申请公布日期 2014.09.22
申请号 JP20130044255 申请日期 2013.03.06
申请人 NEC CORP 发明人 TAKEDA TSUTOMU
分类号 H01L23/34;H01L23/467;H01L23/473;H01L25/065;H01L25/07;H01L25/18;H05K7/20 主分类号 H01L23/34
代理机构 代理人
主权项
地址