发明名称 |
ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT COOLING METHOD |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic component which effectively radiates heat generated in the electronic component and achieves cooling effect.SOLUTION: An electronic component includes: a substrate; a cooling channel which is molded at the substrate and used for passing a cooling medium from a first direction to a second direction; and a radiator which is formed on a surface of the cooling channel using a material having heat conductivity higher than the substrate or is formed at the cooling channel so as to protrude and contacts with the cooling medium.</p> |
申请公布号 |
JP2014175351(A) |
申请公布日期 |
2014.09.22 |
申请号 |
JP20130044255 |
申请日期 |
2013.03.06 |
申请人 |
NEC CORP |
发明人 |
TAKEDA TSUTOMU |
分类号 |
H01L23/34;H01L23/467;H01L23/473;H01L25/065;H01L25/07;H01L25/18;H05K7/20 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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