发明名称 SUBSTRATE PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing device capable of reducing the time required to transfer a substrate without damaging a surface of the substrate and causing a particle due to contact between the substrate and a substrate holding body.SOLUTION: A substrate processing device comprises: a substrate transfer unit which transfers a substrate; a substrate mounting part which is provided in the substrate transfer unit and on which the substrate is mounted; and a tip-side positioning unit and a root-side positioning unit which position the substrate mounted on the substrate mounting part at a prescribed location. The root-side positioning unit further comprises: an expansion and contraction part which expands and contracts in a direction in which the substrate is pressed to the tip-side positioning unit; a holding part provided at a tip of the expansion and contraction part; and a control unit which controls an amount of expansion and contraction of the expansion and contraction part. The control unit controls the amount of expansion and contraction of the expansion and contraction part so that a prescribed interval is formed between the holding part and an outer edge of the substrate.
申请公布号 JP2014175404(A) 申请公布日期 2014.09.22
申请号 JP20130045529 申请日期 2013.03.07
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 SHIBATA TAKESATO;TANIYAMA TOMOSHI
分类号 H01L21/677;C23C16/44;H01L21/205;H01L21/3065;H01L21/31;H01L21/324 主分类号 H01L21/677
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