| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a selection method of a sealing member for an electronic component and a selection device of a sealing member for an electronic component that can select an appropriate under-fill material satisfying required reliability.SOLUTION: A regression expression is previously determined from linear expansion coefficients of a plurality of under-fill materials 4 and the breaking cycle number of respective junctions between an electronic component 1 and printed board 2 formed by using the plurality of under-fill materials 4, and is stored in a database 13. The breaking cycle number required for products is input, a corresponding linear expansion coefficient is determined from the input breaking cycle number on the basis of the regression expression, and an under-fill material 4 having the determined linear expansion coefficient is selected.</p> |
