| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface-mounted crystal oscillator improving reliability by avoiding a connection defect caused by direct conduction of high heat of reflow to packaging terminals of a ground along a grounding path of a metal cover and instability in solder fillet formation between the packaging terminals during packaging.SOLUTION: The surface-mounted crystal oscillator comprises: a metal cover 7 sealing a recess 12 in which a crystal vibrator 2 is accommodated, shielding the recess from an external electromagnetic field; and a plurality of packaging terminals 4a, 4b, 4c and 4d including a ground terminal 4b on a surface of a container body 1 opposite to the metal cover 7. An IC chip 3 includes two IC terminals 31c -1 and 31c-2 connected within the IC chip for grounding, and the one IC terminal 31c-1 is connected to the metal cover 7 through an inner layer conductor pattern 18b formed on a bottom wall of the container body 1 and a via hole 13b formed on a frame wall. The other IC terminal 31c-2 is connected to the packaging terminal 4b for grounding through a wiring pattern 16 formed on the bottom wall 1b of the container body 1 and a via hole 13b formed on the frame wall. |
