发明名称 PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board which allows for reduction of design and component cost, shortening of lead time in manufacture, and reduction of environmental load.SOLUTION: A printed wiring board includes a change wiring formation part 20 where conductive wiring 10a, being changed depending on a plurality of wiring specifications of conductive wiring 10, is formed, and a common wiring formation part 30 including a change wiring fitting part 31 to which the change wiring formation part 20 is fitted, and where conductive wiring 10b common to the plurality of wiring specifications is formed. When the change wiring formation part 20 is fitted to the change wiring fitting part 31, the conductive wiring 10a exposed to a change wiring side fitting surface 20a becoming the fitting surface of the change wiring formation part 20 is connected electrically with the conductive wiring 10b exposed to a common wiring side fitting surface 31a becoming the fitting surface of the change wiring fitting part 31 via a conductive material 40, thus forming a wiring path of the conductive wiring 10.
申请公布号 JP2014175386(A) 申请公布日期 2014.09.22
申请号 JP20130045099 申请日期 2013.03.07
申请人 YAZAKI CORP 发明人 YAMADA HIROAKI;SUZUKI YASUHITO;DOI TEPPEI;FUJIMOTO YUZURU
分类号 H05K1/11;H02G3/16;H05K1/02;H05K1/14 主分类号 H05K1/11
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