| 摘要 |
[PROBLEMS] To provide a lead frame fixing material and the like for excellently and simply fixing lead frames. [MEANS FOR SOLVING PROBLEMS] Provided are a lead frame fixing material having a viscosity of 0.01-10Pa·s at 80°C, a lead frame using such lead frame fixing material, and a semiconductor device using such lead frame. A viscosity change of the fixing material when it is left for 8 hours at an environmental temperature of 25°C is preferably 1.0-1.2 times, and a thermal curing time in the air at a cycling temperature of 195°C is preferably 80 seconds or shorter. |
