| 摘要 |
PROBLEM TO BE SOLVED: To stick a whole surface of a sheet onto a stage even when a wafer is increased in diameter.SOLUTION: A stage (62) has a first holding surface (622) for holding an outer peripheral region of a sheet (S), a second holding surface (623) for holding an inner region of the sheet by an inner bottom surface of a recess (621) provided inside the first holding surface, a side surface (624) forming a closed space (628) by using an inner peripheral surface of the recess, a lower surface (S1) of the sheet and the second holding surface, and a suction port (626) for suctioning air from the closed space. A fine irregularity (627) is provided in at least one of the second holding surface and the lower surface of the sheet. The fine irregularity secures a loophole of the air between the second holding surface and the lower surface of the sheet while the sheet held by the first holding surface is expanded by the suction of the air from the suction port and held by the second holding surface. |
