| 摘要 |
PROBLEM TO BE SOLVED: To prevent circuit elements from being contaminated by contaminants, derived from fluorine-based gas, when cleaning the circuit elements with plasma of mixed gas containing argon gas and fluorine-based gas.SOLUTION: Secondary contaminant cleaning for cleaning secondary contaminants derived from fluorocarbon, adhering to the inner wall of a processing chamber and the anode and cathode, is performed. Secondary contaminant cleaning is performed by supplying argon gas from a gas supply section into a processing space, in a state where there is no circuit element in the processing space, generating a high frequency electric field between the anode and cathode by a power supply device, and generating plasma of argon gas. |
