| 摘要 |
FIELD: chemistry.SUBSTANCE: invention relates to hot-melt adhesives. The hot-melt adhesive contains 5-40 wt % of a copolymer based on ethylene and C-C?-olefin, which is obtained by metallocene-catalysed polymerisation, 10-65 wt % of tackifying resin, 0-35 wt % of a plasticiser and 0.01-30 wt % of additives. The additives are selected from stabilisers, adhesion promoters, fillers or pigments, waxes and/or other polymers, wherein the total amounts to 100%. The copolymer is a block copolymer having invariable elastic properties in the range of 0°C to 25°C, measured as a ratio of the storage modulus E? according to (E'-E')/E'<1.5.EFFECT: method improves process properties of the hot-melt adhesive while preserving mechanical properties in the temperature range to 50°C.18 cl, 5 ex |
