| 摘要 |
FIELD: process engineering.SUBSTANCE: invention relates to production of sandwiched materials used in thin-film instruments and devices. Proposed levelling film comprises levelling ply containing binding polymer resin and inorganic filler as components, at least, on one side of transparent polymer substrate. Note here that the number of foreign particles with mean diameter of 20-100 mcm on levelling air surface does not exceed 5 per m.EFFECT: decreased amount of linear defects at production of thin-film transistor on film surface.3 cl, 1 tbl, 3 ex, 2 dwg |
