| 摘要 |
The present invention relates to an electronic device and a manufacturing method thereof. The electronic device according to the embodiment of the present invention includes a first substrate, a second substrate on which the electronic device is formed, and a bonding film which is interposed between the first substrate and the second substrate and bonds the first substrate to the second substrate by interposing the electronic device. An anti foaming compound is located on an interface between the first substrate and the bonding film or an interface between the second substrate and the bonding film. |
