| 摘要 |
An embodiment relates to a light source module. The light source module according to an embodiment comprises a light emitting device; and a substrate including a base substrate, a circuit pattern layer arranged on the base substrate and including a pad in which the light emitting device is arranged, and a solder resist layer arranged on the circuit pattern layer except for the base substrate and the pad, wherein the upper side of the solder resist layer has fine protrusions. |
