| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection method and an inspection device which are capable of more properly determining the state of a through-hole, in a printed circuit board using an image sensor.SOLUTION: An inspection device 50 comprises a contact image sensor 20. In the contact image sensor 20, a plurality of rod lenses 22 (condensing means) are arranged in a predetermined arrangement direction. The contact image sensor 20 is arranged so that the optical axes of the rod lenses 22 are inclined with respect to the printed circuit board 10. The contact image sensor 20 acquires the image of a region including the through-hole and control means 40 determines the state of the through-hole, based on the image. |
