PRINTED CIRCUIT BOARD PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

A printed circuit board package structure includes a substrate having a first surface and a second surface, a ring-shaped magnetic element, an adhesive layer, conductive portions and conductive channels. The first and second surfaces respectively have first and second metal portions. A ring-shaped concave portion is formed on a position not covered by the first metal portions of the first surface. The ring-shaped magnetic element is placed in the ring-shaped concave portion. The adhesive layer covers the first metal portions and the ring-shaped magnetic element. The conductive portions are formed on the adhesive layer. The conductive channels penetrate the conductive portions, the adhesive layer, and the substrate, and are respectively located in an inner wall and outside an outer wall of the ring-shaped concave portion. Each of the conductive channels includes a conductive film electrically connects to the aligned conductive portion and second metal portion.

主权项

1. A printed circuit board package structure comprising:
a substrate comprising a first surface, and a second surface opposite to the first surface, wherein the first surface and the second surface respectively have a plurality of first metal portions and a plurality of second metal portions, a ring-shaped concave portion is formed on a position that is not covered by the first metal portions of the first surface; a ring-shaped magnetic element placed in the ring-shaped concave portion; an adhesive layer located on the first surface and covering the first metal portions and the ring-shaped magnetic element; a plurality of conductive portions formed on the adhesive layer, and respectively aligned with the second metal portions; and a plurality of conductive channels penetrating the conductive portions, the adhesive layer, and the substrate, wherein the conductive channels are respectively located in an inner wall and out of an outer wall of the ring-shaped concave portion, each of the conductive channels comprising a conductive film which electrically connects to the aligned conductive portion and second metal portion.