SYSTEM-IN-PACKAGE WITH INTERPOSER PITCH ADAPTER

摘要

An integrated circuit package is disclosed that includes a first-pitch die and a second-pitch die. The second-pitch die interconnects to the second-pitch substrate through second-pitch substrates. The first-pitch die interconnects through first-pitch interconnects to an interposer adapter. The pitch of the first-pitch interconnects is too fine for the second-pitch substrate. But the interposer adapter interconnects through second-pitch interconnects to the second-pitch substrate and includes through substrate vias so that I/O signaling between the first-pitch die and the second-pitch die can be conducted through the second-pitch substrate and through the through substrate vias in the interposer adapter.

主权项

1. An integrated circuit, comprising:
a first-pitch die; a second-pitch substrate a second-pitch die interconnected to the second-pitch substrate through a first set of second-pitch interconnects; and an interposer adapter interconnected to the second-pitch substrate through a second set of second-pitch interconnects, wherein the first-pitch die is interconnected to the interposer adapter through first-pitch interconnects, and wherein a pitch for the first-pitch interconnects is less than a pitch for the second-pitch interconnects.