DEPOSITING BULK OR MICRO-SCALE ELECTRODES

摘要

Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.

主权项

1. A method of fabricating or depositing electrode materials, comprising the steps of:
depositing an electrically insulating polymer layer on a substrate, depositing a thin-film electrical conducting layer to form electrical conduits connecting, bulk depositing an electrode layer on said thin-film electrical conducting layer, depositing an encapsulating electrically insulating polymer layer on said thin-film electrical conducting layer and said electrode layer, removing some of said insulating layer covering said electrode layer, and releasing the electrode materials from said substrate.