发明名称 |
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, DISPLAY DEVICE MANUFACTURING METHOD, AND ELECTRONIC APPARATUS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which inhibits immersion of moisture into a semiconductor film and is manufactured by a simpler method; and provide a manufacturing method of the semiconductor device, a display device manufacturing method, and an electronic apparatus manufacturing method.SOLUTION: A semiconductor device manufacturing method comprises: forming a gate electrode and wiring; coating the gate electrode and the wiring with a first insulation film and forming a semiconductor film on the gate electrode across the first insulation film; coating the semiconductor film and the first insulation film with a second insulation film and patterning the second insulation film and the first insulation film by one process to form a connection hole which reaches the wiring and form a first recess at a position adjacent to the semiconductor film; and depositing a first conductive film from the connection hole to the first recess to electrically connect the first conductive film with the wiring by the connection hole and bury the fist conductive film in the first recess. |
申请公布号 |
JP2014170829(A) |
申请公布日期 |
2014.09.18 |
申请号 |
JP20130041728 |
申请日期 |
2013.03.04 |
申请人 |
SONY CORP |
发明人 |
AMARI KOICHI |
分类号 |
H01L21/336;G02F1/1368;G09F9/30;H01L29/786;H01L51/50;H05B33/08;H05B33/14 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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