发明名称 WATER-DISPERSIBLE ACRYLIC PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, AND PRESSURE-SENSITIVE ADHESIVE SHEET
摘要 Provided is a water-dispersible acrylic pressure-sensitive adhesive composition capable of forming a pressure-sensitive adhesive layer that can prevent static build-up at the time of peeling (antistatic properties), is superior in removability, in the ability to prevent an increase in peel strength (adhesive strength) over time among the adhesive properties, as well as in appearance properties (decrease of appearance defects due to dents or the like), and also in less-staining properties on adherends, particularly, in the ability to prevent white staining on adherends in high-humidity environments (the ability to prevent white staining). The water-dispersible acrylic pressure-sensitive adhesive composition according to the invention contains an acrylic emulsion polymer containing, as monomer components, (i) an alkyl (meth)acrylate, (ii) a carboxyl group-containing unsaturated monomer, and (iii) at least one monomer selected from the group consisting of methyl methacrylate, vinyl acetate, and diethylacrylamide, and an ionic compound, and is characterized in that 70 to 99.5% by weight of the alkyl (meth)acrylate (i) is contained in the total amount of the monomer components.
申请公布号 US2014272408(A1) 申请公布日期 2014.09.18
申请号 US201214352896 申请日期 2012.10.12
申请人 NITTO DENKO CORPORATION 发明人 Amano Tatsumi;Morimoto Yu;Mitsui Kazuma;Yonezaki Kousuke;Takashima Kyoko
分类号 C09J7/02 主分类号 C09J7/02
代理机构 代理人
主权项 1. A water-dispersible acrylic pressure-sensitive adhesive composition, comprising an acrylic emulsion polymer comprising, as monomer components, (i) an alkyl (meth)acrylate, (ii) a carboxyl group-containing unsaturated monomer, and (iii) at least one monomer selected from the group consisting of methyl methacrylate, vinyl acetate, and diethylacrylamide, and an ionic compound, wherein 70 to 99.5% by weight of the alkyl (meth)acrylate (i) is contained in the total amount of the monomer components.
地址 Ibaraki-shi, Osaka JP