| 发明名称 |
Package-On-Package with Cavity in Interposer |
| 摘要 |
A package includes an interposer, which includes a core dielectric material, a through-opening extending from a top surface to a bottom surface of the core dielectric material, a conductive pipe penetrating through the core dielectric material, and a device die in the through-opening. The device die includes electrical connectors. A top package is disposed over the interposer. A first solder region bonds the top package to the conductive pipe, wherein the first solder region extends into a region encircled by the conductive pipe. A package substrate is underlying the interposer. A second solder region bonds the package substrate to the interposer. |
| 申请公布号 |
US2014264811(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201414158295 |
申请日期 |
2014.01.17 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Wu Jiun Yi |
| 分类号 |
H01L25/07;H01L25/00 |
主分类号 |
H01L25/07 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package comprising:
an interposer comprising:
a core dielectric material;a through-opening extending from a top surface to a bottom surface of the core dielectric material;a conductive pipe penetrating through the core dielectric material; anda first device die in the through-opening, wherein the first device die comprises electrical connectors; a top package over the interposer; a first solder region bonding the top package to the conductive pipe, wherein the first solder region extends into a region encircled by the conductive pipe; a first package substrate underlying the interposer; and a second solder region bonding the first package substrate to the interposer. |
| 地址 |
Hsin-Chu TW |
