| 发明名称 |
PACKAGING FOR AN ELECTRONIC DEVICE |
| 摘要 |
In one aspect, a method includes processing a metal substrate, performing a first etch on a first surface of the metal substrate to form, for an integrated circuit package, secondary leads and a curved component having two primary leads and performing a second etch, on a second surface of the substrate opposite the first surface, at locations on the secondary leads and locations on the curved component to provide a locking mechanism. Each primary lead located at a respective end of the curved component. |
| 申请公布号 |
US2014264678(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201313834617 |
申请日期 |
2013.03.15 |
| 申请人 |
LIU SHIXI LOUIS;Wong Harianto;David Paul;Sauber John B.;Milano Shaun D.;Kanda Raguvir;Hemenway Bruce |
发明人 |
LIU SHIXI LOUIS;Wong Harianto;David Paul;Sauber John B.;Milano Shaun D.;Kanda Raguvir;Hemenway Bruce |
| 分类号 |
H01L43/04;H01L23/00;H01L21/48 |
主分类号 |
H01L43/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
processing a metal substrate; performing a first etch on a first surface of the metal substrate to form, for an integrated circuit package, secondary leads and a curved component having two primary leads, each primary lead located at a respective end of the curved component; and performing a second etch, on a second surface of the substrate opposite the first surface, at locations on the secondary leads and locations on the curved component to provide a locking mechanism. |
| 地址 |
Worcester MA US |
