MODULE AND METHOD OF MANUFACTURING THE SAME

摘要

An engagement structure for preventing the separation of a resin layer is formed in a contact surface of an insulating substrate in a connecting component, the contact surface being in contact with the resin layer. The resin layer engages with the engagement structure in the contact surface in the insulating substrate in contact with the resin layer, the contact surface forming the side surface of the connecting component.

主权项

1. A module comprising:
a circuit board; a mounting component mounted on a first principal surface of the circuit board; a connecting component for use in external connection mounted on the first principal surface of the circuit board; and a resin layer that covers the first principal surface of the circuit board, the mounting component, and a side surface of the connecting component, the connecting component including:
an insulating substrate; anda plurality of interlayer connection conductors arranged in the insulating substrate, wherein each of the interlayer connection conductors includes a first end connected to the first principal surface of the circuit board and a second end externally connected, and an engagement structure for preventing the resin layer from being separated is formed in a contact surface of the insulating substrate with the resin layer.