发明名称 |
SEMICONDUCTOR PACKAGE STRUCTURE |
摘要 |
Various embodiments relating to semiconductor package structures having reduced thickness while maintaining rigidity are provided. In one embodiment, a semiconductor package structure includes a substrate including a surface, a semiconductor die including a first interface surface connected to the surface of the substrate and a second interface surface opposing the first interface surface, a mold compound applied to the substrate surrounding the semiconductor die. The second interface surface of the semiconductor die is exposed from the mold compound. The semiconductor package structure includes a heat dissipation cover attached to the second interface surface of the semiconductor die and the mold compound. |
申请公布号 |
US2014264816(A1) |
申请公布日期 |
2014.09.18 |
申请号 |
US201313797637 |
申请日期 |
2013.03.12 |
申请人 |
NVIDIA CORPORATION |
发明人 |
Kalchuri Shantanu;Schieck Brian;Yee Abraham |
分类号 |
H01L23/34;H01L21/50 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor package structure comprising:
a substrate including a surface; a semiconductor die including a first interface surface connected to the surface of the substrate and a second interface surface opposing the first interface surface; a mold compound applied to the substrate surrounding the semiconductor die, wherein the second interface surface of the semiconductor die is exposed from the mold compound; and a heat dissipation cover attached to the second interface surface of the semiconductor die and the mold compound. |
地址 |
Santa Clara CA US |