| 发明名称 |
FILM TRANSFERABLE LOGIC CIRCUIT, AND METHODS FOR PROVIDING FILM TRANSFERABLE LOGIC CIRCUIT |
| 摘要 |
A filmic circuit includes a circuit portion and a carrier layer. The circuit portion includes a logic circuit that includes, for example, plural logic gates configurable to receive an input and provide a corresponding logical output. The carrier layer is configured as a film. The circuit portion is affixed directly to the carrier layer or to an upper coat disposed adjacent to the carrier layer, and the carrier layer is configured to be releasable from the circuit portion after the filmic circuit assembly is affixed to a target. The circuit portion is configured to receive an adhesive layer configured to affix the filmic circuit assembly to the target. |
| 申请公布号 |
US2014264462(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201313839010 |
申请日期 |
2013.03.15 |
| 申请人 |
ILLINOIS TOOL WORKS, INC |
发明人 |
SCHNEIDER JOHN H.;HERRING WILLIAM A. |
| 分类号 |
H01L25/065;H01L23/00 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A logic circuit assembly comprising:
a circuit portion comprising a logic circuit, the logic circuit comprising plural logic gates configurable to receive an input and provide a corresponding logical output; and a carrier layer configured as a film, the circuit portion affixed directly to at least one of the carrier layer or an upper coat adjacent to the carrier layer, the carrier layer configured to be releasable from the circuit portion after the circuit assembly is affixed to a target; wherein the circuit portion is configured to receive an adhesive layer configured to affix the circuit assembly to the target. |
| 地址 |
GLENVIEW IL US |
