SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME

摘要

According to one embodiment, a semiconductor module includes: a first circuit component: a second circuit component; and a third circuit component. The first circuit component includes: an insulating first substrate; a first conductive layer; a first switching element; and a first diode. The second circuit component includes: an insulating second substrate; a second conductive layer; a second switching element; and a second diode. The second circuit component is disposed between the first circuit component and the third circuit component. The third circuit component includes: an insulating third substrate; a third conductive layer provided on the third substrate and including a third element mounting unit; a third switching element provided on the third element mounting unit; and a third diode provided on the third element mounting unit. A direction from the third switching element toward the third diode is an opposite direction to the first direction.

主权项

1. A semiconductor module comprising:
a first circuit component including:
an insulating first substrate;a first conductive layer provided on the first substrate and including a first element mounting unit;a first switching element provided on the first element mounting unit; anda first diode provided on the first element mounting unit; a second circuit component provided apart from the first circuit component in a second direction crossing a first direction from the first switching element toward the first diode and including:
an insulating second substrate;a second conductive layer provided on the second substrate and including a second element mounting unit;a second switching element provided on the second element mounting unit; anda second diode provided on the second element mounting unit, a direction from the second switching element toward the second diode being the same direction as the first direction; and a third circuit component, the second circuit component being disposed between the first circuit component and the third circuit component, the third circuit component including:
an insulating third substrate;a third conductive layer provided on the third substrate and including a third element mounting unit;a third switching element provided on the third element mounting unit; anda third diode provided on the third element mounting unit, a direction from the third switching element toward the third diode being an opposite direction to the first direction.