发明名称 |
Thermal Interface Structure for Thermoelectric Devices |
摘要 |
A thermoelectric power generating module incorporates compliance into the module using a three-dimensional flexible connector. The flexible connector may relieve thermal stress and improve reliability for thermoelectric modules. In addition, the connector may provide a buffer layer (e.g., cushion) to damp mechanical vibrations. In further embodiments, a thermal interface structure for a thermoelectric device includes a thermally conductive body comprising a first compliant surface for directly interfacing with a first component of the thermoelectric device and a second compliant surface, opposite the first surface, for directly interfacing with a second component of the thermoelectric device. |
申请公布号 |
US2014261608(A1) |
申请公布日期 |
2014.09.18 |
申请号 |
US201414209519 |
申请日期 |
2014.03.13 |
申请人 |
GMZ Energy, Inc. |
发明人 |
Wang Xiaowei |
分类号 |
H01L35/30;H01L35/34;H01L35/04 |
主分类号 |
H01L35/30 |
代理机构 |
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代理人 |
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主权项 |
1. A thermal interface structure for a thermoelectric device, comprising:
a thermally conductive body comprising a first compliant surface for directly interfacing with a first component of the thermoelectric device and a second compliant surface, opposite the first surface, for directly interfacing with a second component of the thermoelectric device. |
地址 |
Waltham MA US |