发明名称 Thermal Interface Structure for Thermoelectric Devices
摘要 A thermoelectric power generating module incorporates compliance into the module using a three-dimensional flexible connector. The flexible connector may relieve thermal stress and improve reliability for thermoelectric modules. In addition, the connector may provide a buffer layer (e.g., cushion) to damp mechanical vibrations. In further embodiments, a thermal interface structure for a thermoelectric device includes a thermally conductive body comprising a first compliant surface for directly interfacing with a first component of the thermoelectric device and a second compliant surface, opposite the first surface, for directly interfacing with a second component of the thermoelectric device.
申请公布号 US2014261608(A1) 申请公布日期 2014.09.18
申请号 US201414209519 申请日期 2014.03.13
申请人 GMZ Energy, Inc. 发明人 Wang Xiaowei
分类号 H01L35/30;H01L35/34;H01L35/04 主分类号 H01L35/30
代理机构 代理人
主权项 1. A thermal interface structure for a thermoelectric device, comprising: a thermally conductive body comprising a first compliant surface for directly interfacing with a first component of the thermoelectric device and a second compliant surface, opposite the first surface, for directly interfacing with a second component of the thermoelectric device.
地址 Waltham MA US