COMPOSITE MATERIAL, SUBSTRATE, SHELL FOR AN ELECTRONIC DEVICE AND METHOD OF PREPARING THE SAME

摘要

The present disclosure discloses a composite material. The composite material contains an epoxy resin, a nylon, a curing agent and a mold release agent. The mold release agent contains polytetrafluoroethylene. A substrate including the composite material, a method for preparing the substrate, a shell of an electronic device including the substrate and a method for preparing the shell are also provided.