发明名称 ELECTRONIC DEVICE HAVING ASSEMBLY ASSISTING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide an electronic device having an assembly assisting structure capable of assuring a heat radiation function of a heat radiation sheet and capable of improving assemblability when an electronic device body equipped with a heating component covered with the heat radiation sheet is made to slide sideways into a case for assembling.SOLUTION: Relating to an electronic device having an assembly assisting structure, an electronic device body is inserted into a case, and the electronic device body includes a substrate, a heating component which has a heating component subject and a fitting leg, to be fitted to the substrate by the fitting leg, and a heat radiation sheet which is installed at a portion facing the case of the heating component subject and/or a portion facing the case of the fitting leg. The assembly assisting structure is a cover sheet whose friction factor is smaller than that of the heat radiation sheet arranged between the heat radiation sheet and the case. At a position of the cover sheet for covering the heat radiation sheet, one or more openings are formed and a peripheral part surrounding the opening contacts to the heat radiation sheet.
申请公布号 JP2014170915(A) 申请公布日期 2014.09.18
申请号 JP20130235302 申请日期 2013.11.13
申请人 OMRON CORP 发明人 KUBO MASAHIKO ; KAMIUCHI MASAYUKI ; ONISHI HIROYUKI ; OKADA HIROSHI ; KAWANO HIROKI ; KUROKO MASASHI ; TAKATORI KOJI ; YANO KOHEI ; MINAMIDE KENHACHIRO ; NISHIDA MASAMI ; NIWA HIROKI ; MARUMO KATSUYA ; MORISHITA SADAJI
分类号 H05K7/20 主分类号 H05K7/20
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