发明名称 ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an electronic apparatus which improves heat radiation performance of an entire case while inhibiting an outer surface temperature of the case from locally rising near a heating part.SOLUTION: A power supply device 100 (an electronic apparatus) includes: a case 20 which houses a circuit board 10; a heat diffusion layer 30 which is provided at the inner side of the case 20; an insulation layer 40 which is provided between the heat diffusion layer 30 and the circuit board 10 tightly contacting with the heat diffusion layer 30; and a heat insulation layer 50 provided between an inner surface of the case 20 and the heat diffusion layer 30 in an area near a heating part hg of the circuit board 10. In a region other than the area near the heating part hg, the heat diffusion layer 30, which is provided with the insulation layer 40 tightly adhering thereto, is disposed so as to tightly contact with the inner surface of the case 20.
申请公布号 JP2014170855(A) 申请公布日期 2014.09.18
申请号 JP20130042273 申请日期 2013.03.04
申请人 FUNAI ELECTRIC CO LTD 发明人 YOSHIOKA SHINJI ; MURAOKA OSHI
分类号 H05K7/20;H02M7/04 主分类号 H05K7/20
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