发明名称 |
ELECTRONIC COMPONENT BONDING METHOD |
摘要 |
The present invention ensures a good bonding state between the electrode terminals of electronic components and the electrodes of a substrate, and achieves an increase in productivity and a downsizing of the substrate. The present invention includes: an applying step of applying a metal fine powder paste on each of multiple electrodes that are provided on a substrate; a component placing step of placing multiple electronic components with different heights, on the multiple electrodes, respectively; an organic film placing step of placing an organic film on the multiple electronic components; an organic film compressing step of applying a first pressure to the electronic component side with a pressing member and equalizing the height of the organic film; and a bonding step of applying a second pressure to the electronic component side with a compressing member on heating for a predetermined time and sintering the metal fine powder paste. |
申请公布号 |
US2014263581(A1) |
申请公布日期 |
2014.09.18 |
申请号 |
US201414208472 |
申请日期 |
2014.03.13 |
申请人 |
SUGA Tadatomo;MIZUKOSHI Masataka;ALPHA DESIGN CO., LTD. |
发明人 |
SHIRATORI Toshiyuki;KAWASAKI Toru;SUGA Tadatomo;MIZUKOSHI Masataka |
分类号 |
H05K13/04 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
1. An electronic component bonding method comprising:
an applying step of applying a metal fine powder paste on each of multiple electrodes that are provided on a substrate; a component placing step of placing multiple electronic components in positional alignment with the multiple electrodes respectively, the multiple electronic components including at least two electronic components that have different heights; an organic film placing step of placing an organic film on the multiple electronic components, the organic film having a thickness greater than a height difference between the highest electronic component and the lowest electronic component of the multiple electronic components; an organic film compressing step of pressing a pressing surface of a pressing member against the organic film, applying a first pressure to the electronic component side with the pressing member, and equalizing a height of a pressed surface of the organic film, the pressing surface having a planar shape, the pressing member being heated to a predetermined temperature, the pressed surface being pressed by the pressing surface; and a bonding step of pressing a compressing surface of a compressing member against the pressed surface, applying a second pressure to the electronic component side with the compressing member on heating for a predetermined time, and sintering the metal fine powder paste to bond electrode terminals of the multiple electronic components to the electrodes of the substrate respectively, the compressing surface having a planar shape. |
地址 |
Tokyo JP |