Packages of MEMS

摘要

The present invention provides a flip-chip package for MEMS device without time consuming wire-bonding. Bonding a silicon chip to a printed circuit board can be achieved by restricting the heat deformation of printed circuit board with adhered glass substrate which has similar heat expansion coefficient as silicon.

主权项

1. A MEMS package for containing and protecting a MEMS device wherein the MEMS package comprising:
a printed circuit board (PCB) having a MEMS device opening for placing and exposing the MEMS device through the MEMS device opening disposed on a center portion of the PCB wherein said MEMS device further having conductive bumps disposed on peripheral portions of the MEMS device and the conductive bumps contacting and supported on corresponding conductive pads disposed on the PCB; and a glass substrate disposed below the PCB and adhere to a first surface of the PCB opposite a second surface of the PCB with the conductive pads contacting and supporting the conductive pads of the MEMS device.