| 发明名称 |
Pressuring Module, Pressuring Apparatus, Substrate Bonding Apparatus, Substrate Bonding Method, and Bonded Substrate |
| 摘要 |
A pressuring module includes a stage having a mounting surface on which an object to be pressured is mounted; a plurality of pressure detecting sections that detect a pressure applied on the mounting surface; and a pressure varying section that varies a pressure distribution across a plane of the mounting surface, by differing a pressing force against the object to be pressured between a periphery and a central portion of the mounting surface in a plane direction of the mounting surface based on the pressure detected by the plurality of pressure detecting sections. |
| 申请公布号 |
US2014262045(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201414299511 |
申请日期 |
2014.06.09 |
| 申请人 |
NIKON CORPORATION |
发明人 |
Tanaka Keiichi;IZUMI SHIGETO |
| 分类号 |
B32B41/00;B32B37/10 |
主分类号 |
B32B41/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A pressuring module comprising:
a stage having a mounting surface on which an object to be pressured is mounted; a plurality of pressure detecting sections that detect a pressure applied on the mounting surface; and a pressure varying section that varies a pressure distribution across a plane of the mounting surface, by differing a pressing force against the object to be pressured between a periphery and a central portion of the mounting surface in a plane direction of the mounting surface based on the pressure detected by the plurality of pressure detecting sections. |
| 地址 |
TOKYO JP |
