发明名称 STRUCTURE FOR BONDING METAL PARTS TO EACH OTHER AND BONDING METHOD THEREFOR
摘要 A flange (24) is provided on the perimeter of a metal cap (21). A wire (25) is formed in a ring shape and disposed on the lower surface of the flange (24). Preferably, the wire (25) is tack-welded to the lower surface of the flange (24). The wire (25) used has a melting point in the range of -150°C to +150°C with respect to the melting points of the metal cap (21) and the metal base (22). The flange (24) of the metal cap (21) is placed on the metal base (22) with the wire (25) interposed therebetween. Then, an electric current is passed between the flange (24) of the metal cap (21) and the metal base (22) to melt the wire (25) and resistance-weld the flange (24) to the metal base (22).
申请公布号 WO2014141829(A1) 申请公布日期 2014.09.18
申请号 WO2014JP53824 申请日期 2014.02.18
申请人 OMRON CORPORATION 发明人 YOSHIOKA HIDEKAZU;NAGASAKA SHOGO;TSUCHIDA MAKOTO;YOSHIDA HITOSHI
分类号 B23K11/00;B23K11/14;H01H11/00;H01H49/00;H01H50/02 主分类号 B23K11/00
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