发明名称 |
RECEPTACLE ASSEMBLY AND TRANSCEIVER MODULE ASSEMBLY |
摘要 |
<p>In a receptacle cage (12), a heat sink support mechanism is configured from a curved piece (126S2) and two pressing springs (126S1) formed in a curved section formed on the uppermost end of a side wall (126) configuring the receptacle cage (12), and from a curved piece (127S2) and two pressing springs (127S1) formed on a top plate (127), and a heat sink fixing means is configured from a lock piece (12RP) provided on the back surface of the receptacle cage (12) and from a leaf spring (12LF) which biases a protruding part (26E) on the heat sink (26) towards the locking piece (12RP).</p> |
申请公布号 |
WO2014141490(A1) |
申请公布日期 |
2014.09.18 |
申请号 |
WO2013JP62979 |
申请日期 |
2013.05.08 |
申请人 |
YAMAICHI ELECTRONICS CO., LTD. |
发明人 |
ITO TOSHIYASU;SATO SHIGERU;TAKAI YOSUKE |
分类号 |
H01R13/533;G02B6/42;H01R13/66;H01S5/022;H01S5/024 |
主分类号 |
H01R13/533 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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