发明名称 RECEPTACLE ASSEMBLY AND TRANSCEIVER MODULE ASSEMBLY
摘要 <p>In a receptacle cage (12), a heat sink support mechanism is configured from a curved piece (126S2) and two pressing springs (126S1) formed in a curved section formed on the uppermost end of a side wall (126) configuring the receptacle cage (12), and from a curved piece (127S2) and two pressing springs (127S1) formed on a top plate (127), and a heat sink fixing means is configured from a lock piece (12RP) provided on the back surface of the receptacle cage (12) and from a leaf spring (12LF) which biases a protruding part (26E) on the heat sink (26) towards the locking piece (12RP).</p>
申请公布号 WO2014141490(A1) 申请公布日期 2014.09.18
申请号 WO2013JP62979 申请日期 2013.05.08
申请人 YAMAICHI ELECTRONICS CO., LTD. 发明人 ITO TOSHIYASU;SATO SHIGERU;TAKAI YOSUKE
分类号 H01R13/533;G02B6/42;H01R13/66;H01S5/022;H01S5/024 主分类号 H01R13/533
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