| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thin semiconductor device.SOLUTION: The semiconductor device has a semiconductor element layer 202 having a function of wireless communication, a microstructure 203 having a function of a sensor, and wiring 204a, 204b for electrically connecting the semiconductor element layer with the microstructure on a flexible substrate 201. In a method for manufacturing the semiconductor device, a first layer and a second layer which mutually have weak adhesiveness are formed on a first substrate, the semiconductor element layer 202 having the function of wireless communication and an insulating layer 213 are formed on the second layer, first wiring electrically connected with the semiconductor element layer, a sacrificial layer, and second wiring are formed on the insulating layer. The first layer and the second layer are separated, so that the semiconductor element layer, the insulating layer, the first wiring, the sacrificial layer, and the second wiring are separated from the substrate and then stuck on a second flexible substrate, and the sacrificial layer is removed, and accordingly the first wiring, the second wiring, and the microstructure having a space between the first wiring and the second wiring and having the function of the sensor are manufactured. |
