| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-free joining material having improved fusibility.SOLUTION: In one embodiment, the lead-free joining material composed of Sn and Cu is provided in which: one kind or two kinds of Bi or In are added to an SnCu alloy; a component composition of the lead-free joining material is composed of, by mass%, Cu:15-33%, Sn:50-84%, and one kind or two kinds of Bi or In of 1-17% in total; and the number of particles having a circularity of 0.925-1.0 is 40% or more of the whole. In the above lead-free joining material in another embodiment, an intermetallic compound constituted of Sn and CU is dispersed in an Sn base, and Bi and In are dispersed as a fine phase of 5 μm or less in the Sn base and/or are forcedly solid-solved in the Sn base. |
