| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus, method and recording medium capable of quickly and sufficiently subjecting the surface of a substrate to hydrophobic treatment.SOLUTION: An adhesion unit U5 comprises: a cooling unit 40; a light irradiation unit 50; an air-supply unit 60; a lifting unit 80; and a control unit 90. A cooling plate 41 of the cooling unit 40 faces a rear surface Wb of a wafer W. A light source 51a of the light irradiation unit 50 facing a top surface Wa of the wafer W via a gap emits light for radiation heating. A gas storage body 61 of the air-supply unit 60 covers a lower side of the light source 51a and faces the top surface Wa of the wafer W via a gap. A plurality of gas discharge ports 63 are provided on a lower side of the gas storage body 61. The control unit 90 controls the lifting unit 80 to allow the wafer W to come close to the cooling plate 41 and then controls the air-supply unit 60 to send out a hydrophobic treatment gas, and then controls the light irradiation unit 50 to allow the light source 51a to emit light and controls the lifting unit 80 to allow the wafer W to come close to the light source and then controls the air-supply unit 60 to send out the hydrophobic treatment gas. |
