发明名称 DEPOSITION OF SMOOTH METAL NITRIDE FILMS
摘要 In one aspect, methods of forming smooth ternary metal nitride films, such as TixWyNz films, are provided. In some embodiments, the films are formed by an ALD process comprising multiple super-cycles, each super-cycle comprising two deposition sub-cycles. In one sub-cycle a metal nitride, such as TiN is deposited, for example from TiCl4 and NH3, and in the other sub-cycle an elemental metal, such as W, is deposited, for example from WF6 and Si2H6. The ratio of the numbers of each sub-cycle carried out within each super-cycle can be selected to achieve a film of the desired composition and having desired properties.
申请公布号 US2014273452(A1) 申请公布日期 2014.09.18
申请号 US201313802157 申请日期 2013.03.13
申请人 ASM IP HOLDING B.V. 发明人 Blomberg Tom E.;Anttila Jaakko
分类号 H01L21/285 主分类号 H01L21/285
代理机构 代理人
主权项 1. An atomic layer deposition (ALD) process for depositing a ternary metal nitride film on a substrate, the process comprising a plurality of super-cycles, each super-cycle comprising a TiN sub-cycle and a W sub-cycle, wherein the TiN sub-cycle comprises alternately and sequentially contacting the substrate with a titanium precursor and a nitrogen reactant; wherein the W sub-cycle comprises alternately and sequentially contacting the substrate with a tungsten precursor and a second precursor, wherein the second precursor is a silane or borane; and wherein the film does not have a columnar grain structure.
地址 Almere NL